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Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
Detailed Information
- Material Type
- 기사
- ISSN
- 12269328
- Title/Author
- Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles / Jeong-Hwan Kim, Ji-Whan Ahn
- Publish Info
- 서울 : 한국암반공학회, 2004.
- Material Info
- pp. 63-68
- Index Term-Uncontrolled
- RHEOLOGICAL PROPERTIES SOLDER PASTE CONTAINING LEADFREE PARTICLES COATED POLYMER WAX
- Added Entry-Personal Name
- Jeong-Hwan Kim, Ji-Whan Ahn
- Host Item Entry
- Geosystem Engineering : 2004 September (Vol.7 No.3) 2004, 09
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075006
MARC
008060428s2004 ULKa a ENG■022 ▼a12269328
■245 ▼aRheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles▼dJeong-Hwan Kim, Ji-Whan Ahn
■260 ▼a서울▼b한국암반공학회▼c2004.
■300 ▼app. 63-68
■653 ▼aRHEOLOGICAL▼aPROPERTIES▼aSOLDER▼aPASTE▼aCONTAINING▼aLEADFREE▼aPARTICLES▼aCOATED▼aPOLYMER▼aWAX
■700 ▼aJeong-Hwan Kim, Ji-Whan Ahn
■773 ▼tGeosystem Engineering▼g2004 September (Vol.7 No.3)▼d2004, 09
■URL ▼ahttp://www.ksge.or.kr
■SIS ▼aS013497▼b60053900▼h8▼s2
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