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Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment
Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment
Detailed Information
- 자료유형
- 기사
- ISSN
- 15986462
- 서명/저자
- Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment / T. H. Song, J. K. Lee, S. Y. Park
- 발행사항
- 서울 : 한국부식방식학회(구)한국부식학회, 2005.
- 형태사항
- pp. 222-225
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60074580
MARC
008060425s2005 ULKa a ENG■022 ▼a15986462
■245 ▼aElectroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment▼dT. H. Song, J. K. Lee, S. Y. Park
■260 ▼a서울▼b한국부식방식학회(구)한국부식학회▼c2005.
■300 ▼app. 222-225
■653 ▼aELECTROLESS▼aNI▼aPLATING▼aPC▼aIMPROVE▼aADHESION▼aDBD▼aPLASMA▼aTREATMENT
■700 ▼aT. H. Song, J. K. Lee, S. Y. Park
■773 ▼tCorrosion Science and Technology▼gVOL.4 NO.6 (2005 December)▼d2005, 12
■URL ▼ahttp://www.corrosion.or.kr
■SIS ▼aS021073▼b60053755▼h8▼s2
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