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Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
상세정보
- 자료유형
- 기사
- ISSN
- 12259438
- 서명/저자
- Mechanical Strength Test Method for Solder Ball Joint in BGA Package / Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
- 발행사항
- 서울 : Metals and Materials, 2005.
- 형태사항
- pp. 121-130
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60066345
MARC
008060201s2005 ULKa a ENG■022 ▼a12259438
■245 ▼aMechanical Strength Test Method for Solder Ball Joint in BGA Package▼dJong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
■260 ▼a서울▼bMetals and Materials▼c2005.
■300 ▼app. 121-130
■653 ▼aMECHANICAL▼aSTRENGTH▼aTEST▼aMETHOD▼aSOLDER▼aBALL▼aJOINT▼aBGA▼aPACKAGE
■700 ▼aJong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
■773 ▼tMetals and Materials▼gVOL.11 NO.2 (2005 APRIL)▼d2005, 04
■SIS ▼aS011038▼b60013551▼h8▼s2
