서브메뉴
검색
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Detailed Information
- Material Type
- 기사
- ISSN
- 12259438
- Title/Author
- Mechanical Strength Test Method for Solder Ball Joint in BGA Package / Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
- Publish Info
- 서울 : Metals and Materials, 2005.
- Material Info
- pp. 121-130
- Added Entry-Personal Name
- Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
- Host Item Entry
- Metals and Materials : VOL.11 NO.2 (2005 APRIL) 2005, 04
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60066345
MARC
008060201s2005 ULKa a ENG■022 ▼a12259438
■245 ▼aMechanical Strength Test Method for Solder Ball Joint in BGA Package▼dJong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
■260 ▼a서울▼bMetals and Materials▼c2005.
■300 ▼app. 121-130
■653 ▼aMECHANICAL▼aSTRENGTH▼aTEST▼aMETHOD▼aSOLDER▼aBALL▼aJOINT▼aBGA▼aPACKAGE
■700 ▼aJong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
■773 ▼tMetals and Materials▼gVOL.11 NO.2 (2005 APRIL)▼d2005, 04
■SIS ▼aS011038▼b60013551▼h8▼s2
Preview
Export
ChatGPT Discussion
AI Recommended Related Books
Detail Info.
- Reservation
- Not Exist
- My Folder
- Reference Materials for Thesis Writing
- Reference Materials for Research Ethics
- Job-Related Books
