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Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications /...
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications

Detailed Information

자료유형  
 기사
ISSN  
12259438
서명/저자  
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications / 저 J.H. Choy
발행사항  
서울 : 대한금속.재료학회, 2004.
형태사항  
pp. 417-422
키워드  
STABILITY INTERFACE VOIDS COPPER METALLIZATION INTEGRATED CIRCUIT APPLICATIONS
기타저자  
J.H. Choy
기본자료저록  
Metals and Materials : VOL.10 NO.5 (2004 OCTOBER) 2004, 10
모체레코드  
모체정보확인
Control Number  
kjul:60055271

MARC

 008050913s2004        ULKa    a                          ENG
■022    ▼a12259438
■245    ▼aStability  of  Interface  Voids  in  Copper  Metallization  for  Integrated  Circuit  Applications▼d저  J.H.  Choy
■260    ▼a서울▼b대한금속.재료학회▼c2004.
■300    ▼app.  417-422
■653    ▼aSTABILITY▼aINTERFACE▼aVOIDS▼aCOPPER▼aMETALLIZATION▼aINTEGRATED▼aCIRCUIT▼aAPPLICATIONS
■700    ▼aJ.H.  Choy
■773    ▼tMetals  and  Materials▼gVOL.10  NO.5  (2004  OCTOBER)▼d2004,  10
■SIS    ▼aS010856▼b60013551▼h1▼s2▼fP

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