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Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Detailed Information
- Material Type
- 기사
- ISSN
- 12259438
- Title/Author
- Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization / 공저 J.H. Choy, K.L. Kavanagh, Y.C. Kim
- Publish Info
- 서울 : 대한금속.재료학회, 2004.
- Material Info
- pp. 411-416
- Index Term-Uncontrolled
- EVOLUTION INTERFACE VOIDS CURRENT TEMPERATURE STRESS INTEGRATE CIRCUIT METALLIZATION
- Added Entry-Personal Name
- J.H. Choy, K.L. Kavanagh, Y.C. Kim
- Host Item Entry
- Metals and Materials : VOL.10 NO.5 (2004 OCTOBER) 2004, 10
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60055270
MARC
008050913s2004 ULKa a ENG■022 ▼a12259438
■245 ▼aEvolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization▼d공저 J.H. Choy, K.L. Kavanagh, Y.C. Kim
■260 ▼a서울▼b대한금속.재료학회▼c2004.
■300 ▼app. 411-416
■653 ▼aEVOLUTION▼aINTERFACE▼aVOIDS▼aCURRENT▼aTEMPERATURE▼aSTRESS▼aINTEGRATE▼aCIRCUIT▼aMETALLIZATION
■700 ▼aJ.H. Choy, K.L. Kavanagh, Y.C. Kim
■773 ▼tMetals and Materials▼gVOL.10 NO.5 (2004 OCTOBER)▼d2004, 10
■SIS ▼aS010856▼b60013551▼h1▼s2▼fP
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