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도체판이 삽입된 밀리미파 세라믹 패키지
도체판이 삽입된 밀리미파 세라믹 패키지
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MARC
008050729s2004 ULKa a KOR■022 ▼a1229635X
■245 ▼a도체판이 삽입된 밀리미파 세라믹 패키지▼d김지태, 서재옥, 방현국, 박성대, 조현민, 강남기, 이해영 공저
■260 ▼a서울▼b대한전자공학회▼c2004.
■300 ▼app. 19
■653 ▼a도체▼a판이▼a삽입▼a밀리▼a세라믹
■700 ▼a김지태, 서재옥, 방현국, 박성대, 조현민, 강남기, 이해영
■773 ▼t전자공학회논문지TC(TeleCommunications) : 통신▼g제41권 제8호 (2004 8)▼d2004, 08
■SIS ▼aS010824▼b60014394▼h8▼s2
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