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Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
Detailed Information
- Material Type
- 기사
- ISSN
- 12259438
- Title/Author
- Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods / 공저 Ohsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim
- Publish Info
- 서울 : 대한금속.재료학회, 2004.
- Material Info
- pp. 107
- Index Term-Uncontrolled
- DIRECT BONDING SILICON PAIRS HETEROGENEOUS INSULATOR USING DIFFERENT ANNEALING METHODS
- Added Entry-Personal Name
- Ohsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim
- Host Item Entry
- Metals and Materials : VOL.10 NO.1 (2004 FEBRUARY) 2004, 02
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60046366
MARC
008050728s2004 ULKa a ENG■022 ▼a12259438
■245 ▼aDirect Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods▼d공저 Ohsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim
■260 ▼a서울▼b대한금속.재료학회▼c2004.
■300 ▼app. 107
■653 ▼aDIRECT▼aBONDING▼aSILICON▼aPAIRS▼aHETEROGENEOUS▼aINSULATOR▼aUSING▼aDIFFERENT▼aANNEALING▼aMETHODS
■700 ▼aOhsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim
■773 ▼tMetals and Materials▼gVOL.10 NO.1 (2004 FEBRUARY)▼d2004, 02
■SIS ▼aS010564▼b60013551▼h8▼s2
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