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Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
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MARC
008050728s2004 ULKa a ENG■022 ▼a12259438
■245 ▼aDirect Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods▼d공저 Ohsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim
■260 ▼a서울▼b대한금속.재료학회▼c2004.
■300 ▼app. 107
■653 ▼aDIRECT▼aBONDING▼aSILICON▼aPAIRS▼aHETEROGENEOUS▼aINSULATOR▼aUSING▼aDIFFERENT▼aANNEALING▼aMETHODS
■700 ▼aOhsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim
■773 ▼tMetals and Materials▼gVOL.10 NO.1 (2004 FEBRUARY)▼d2004, 02
■SIS ▼aS010564▼b60013551▼h8▼s2
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