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Effects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints : AGrowth Kinetic Model
Effects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints : AGrowth Kinetic Model
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MARC
008050728s2004 ULKa a ENG■022 ▼a12259438
■245 ▼aEffects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints▼bAGrowth Kinetic Model▼d공저 Joo-Youl Huh, Sang-Uk Han, Chang-Yong Park
■260 ▼a서울▼b대한금속.재료학회▼c2004.
■300 ▼app. 123-132
■653 ▼aEFFECTS▼aBISMUTH▼aGROWTH▼aKINETICS▼aINTERMETALLIC▼aCOMPOUNDS▼aSN3.5AG▼aSOLDER▼aJOINTS
■700 ▼aJoo-Youl Huh, Sang-Uk Han, Chang-Yong Park
■773 ▼tMetals and Materials▼gVOL.10 NO.2 (2004 APRIL)▼d2004, 04
■SIS ▼aS010707▼b60013551▼h8▼s2
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