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Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering / Jong-Hyun Lee,Dong-Hyuk ...
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering

Detailed Information

자료유형  
 기사
ISSN  
12259438
서명/저자  
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering / Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim
발행사항  
서울 : 대한금속.재료학회, 2003.
형태사항  
pp. 577-582
키워드  
DISSOLUTION CU SNBASES SOLDERS REFLOW SLLDERING
기타저자  
Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim
기본자료저록  
Metals and Materials : VOL.9 NO.6 (2003 DECEMBER) 2003, 12
모체레코드  
모체정보확인
Control Number  
kjul:60028622

MARC

 008031223s2003        ULKa    a                          ENG
■022    ▼a12259438
■245    ▼aDissolution  of  Cu  Into  Sn-Bases  Solders  during  Reflow  Slldering▼dJong-Hyun  Lee,Dong-Hyuk  Shin,Yong-Seog  Kim
■260    ▼a서울▼b대한금속.재료학회▼c2003.
■300    ▼app.  577-582
■653    ▼aDISSOLUTION▼aCU▼aSNBASES▼aSOLDERS▼aREFLOW▼aSLLDERING
■700    ▼aJong-Hyun  Lee,Dong-Hyuk  Shin,Yong-Seog  Kim
■773    ▼tMetals  and  Materials▼gVOL.9  NO.6  (2003  DECEMBER)▼d2003,  12
■SIS    ▼aS010509▼b60013551▼h8▼s2

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