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A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials
A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials
Detailed Information
- 자료유형
- 기사
- ISSN
- 12264865
- 서명/저자
- A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials / Youn-Eui Shin,Jun-Hwan Lee,Young-Wook Koh,Chong-Won Lee
- 발행사항
- 서울 : 대한기계학회, 2002.
- 형태사항
- pp. 919-926
- 초록/해제
- 요약Materials & FractureㆍSolids & StructuresㆍDynamics & ControlㆍProduction & Design
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60020584
MARC
008030808s2002 ULKa a ENG■022 ▼a12264865
■245 ▼aA Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials▼dYoun-Eui Shin,Jun-Hwan Lee,Young-Wook Koh,Chong-Won Lee
■260 ▼a서울▼b대한기계학회▼c2002.
■300 ▼app. 919-926
■520 ▼aMaterials & FractureㆍSolids & StructuresㆍDynamics & ControlㆍProduction & Design
■653 ▼aSTUDY▼aSOLDER▼aJOINTS▼aRELIABILITY▼aUSING▼aLEADFREE▼aMATERIALS
■700 ▼aYoun-Eui Shin,Jun-Hwan Lee,Young-Wook Koh,Chong-Won Lee
■773 ▼tKSME International Journal▼gVol.16 No.7 (2002 July)▼d2002, 07
■SIS ▼aS009321▼b60013846▼h8▼s2
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