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Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow
Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow...
Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow

Detailed Information

자료유형  
 기사
ISSN  
12264865
서명/저자  
Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow / 공저 Mingoo Choi,Keumnam Cho
발행사항  
서울 : 대한기계학회, 2000.
형태사항  
pp. 997-1004
키워드  
EFFECT CHIP SPACING MULTICHIP MODULE HEAT TRASFER PARAFFIN SLURRY FLOW
기타저자  
Mingoo Choi,Keumnam Cho
기본자료저록  
KSME International Journal : Vol.14 No.9 (2000 September) 2000, 09
모체레코드  
모체정보확인
Control Number  
kjul:60018495

MARC

 008000109s2000        ULKa    a                          ENG
■022    ▼a12264865
■245    ▼aEffect  of  Chip  Spacing  in  a    Multichip  Module  on  the  Heat  Trasfer  for  Paraffin  Slurry  Flow▼d공저  Mingoo  Choi,Keumnam  Cho
■260    ▼a서울▼b대한기계학회▼c2000.
■300    ▼app.  997-1004
■653    ▼aEFFECT▼aCHIP▼aSPACING▼aMULTICHIP▼aMODULE▼aHEAT▼aTRASFER▼aPARAFFIN▼aSLURRY▼aFLOW
■700    ▼aMingoo  Choi,Keumnam  Cho
■773    ▼tKSME  International  Journal▼gVol.14  No.9  (2000  September)▼d2000,  09
■SIS    ▼aS009299▼b60013846▼h8▼s2

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