서브메뉴
검색
Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow
Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow
Detailed Information
- Material Type
- 기사
- ISSN
- 12264865
- Title/Author
- Effect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow / 공저 Mingoo Choi,Keumnam Cho
- Publish Info
- 서울 : 대한기계학회, 2000.
- Material Info
- pp. 997-1004
- Added Entry-Personal Name
- Mingoo Choi,Keumnam Cho
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60018495
MARC
008000109s2000 ULKa a ENG■022 ▼a12264865
■245 ▼aEffect of Chip Spacing in a Multichip Module on the Heat Trasfer for Paraffin Slurry Flow▼d공저 Mingoo Choi,Keumnam Cho
■260 ▼a서울▼b대한기계학회▼c2000.
■300 ▼app. 997-1004
■653 ▼aEFFECT▼aCHIP▼aSPACING▼aMULTICHIP▼aMODULE▼aHEAT▼aTRASFER▼aPARAFFIN▼aSLURRY▼aFLOW
■700 ▼aMingoo Choi,Keumnam Cho
■773 ▼tKSME International Journal▼gVol.14 No.9 (2000 September)▼d2000, 09
■SIS ▼aS009299▼b60013846▼h8▼s2
Preview
Export
ChatGPT Discussion
AI Recommended Related Books
Detail Info.
- Reservation
- Not Exist
- My Folder
- Reference Materials for Thesis Writing
- Reference Materials for Research Ethics
- Job-Related Books
