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Thermal Stain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry
Thermal Stain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry
Detailed Information
- Material Type
- 기사
- ISSN
- 12264865
- Title/Author
- Thermal Stain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry / 공저 Koung Suk Kim,Wan Shik Jang
- Publish Info
- 서울 : 대한기계학회, 2000.
- Material Info
- pp. 477-482
- Index Term-Uncontrolled
- THERMAL STAIN ANALYSIS COMPOSITE MATERIALS ELECTRONIC SPECKLE PATTERN INTERFEROMETRY
- Added Entry-Personal Name
- Koung Suk Kim,Wan Shik Jang
- Host Item Entry
- KSME International Journal : Vol.14 No.5 (2000 May) 2000, 05
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60018375
MARC
008000109s2000 ULKa a ENG■022 ▼a12264865
■245 ▼aThermal Stain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry▼d공저 Koung Suk Kim,Wan Shik Jang
■260 ▼a서울▼b대한기계학회▼c2000.
■300 ▼app. 477-482
■653 ▼aTHERMAL▼aSTAIN▼aANALYSIS▼aCOMPOSITE▼aMATERIALS▼aELECTRONIC▼aSPECKLE▼aPATTERN▼aINTERFEROMETRY
■700 ▼aKoung Suk Kim,Wan Shik Jang
■773 ▼tKSME International Journal▼gVol.14 No.5 (2000 May)▼d2000, 05
■SIS ▼aS009295▼b60013846▼h8▼s2
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