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Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Detailed Information
- 자료유형
- 기사
- ISSN
- 12264865
- 서명/저자
- Evaluation of Thermal Deformation in Electronic Packages / 저 Hyeon Gyu Beom
- 발행사항
- 서울 : 대한기계학회, 2000.
- 형태사항
- pp. 251-260
- 기타저자
- Hyeon Gyu Beom
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60018344
MARC
008000109s2000 ULKa a ENG■022 ▼a12264865
■245 ▼aEvaluation of Thermal Deformation in Electronic Packages▼d저 Hyeon Gyu Beom
■260 ▼a서울▼b대한기계학회▼c2000.
■300 ▼app. 251-260
■653 ▼aEVALUATION▼aTHERMAL▼aDEFORMATION▼aELECTRONIC▼aPACKAGES
■700 ▼aHyeon Gyu Beom
■773 ▼tKSME International Journal▼gVol.14 No.2 (2000 February)▼d2000, 02
■SIS ▼aS009292▼b60013846▼h8▼s2
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