본문

서브메뉴

검색

  1. Home
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Under...
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers

Detailed Information

자료유형  
 기사
ISSN  
12259438
서명/저자  
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers / 공저 Young Bae Par, Dok Won Lee
발행사항  
서울 : 대한금속.재료학회, 2001.
형태사항  
pp. 493-498
키워드  
PACKAGE WAFER LEVEL ELECTROMIGRATION TEST ALCU INTERCONNECT UNDERLAYERS
기타저자  
Young Bae Par, Dok Won Lee
기본자료저록  
Metals and Materials : VOL.7 NO.5 (2001 OCTOBER) 2001, 10
모체레코드  
모체정보확인
Control Number  
kjul:60017491

MARC

 008000107s2001        ULKa    a                          ENG
■022    ▼a12259438
■245    ▼aPackage-  and  Wafer  Level  Electromigration  Test  on  Al-Cu  interconnect  with  Ti  and  TiN  Underlayers▼d공저  Young  Bae  Par,  Dok  Won  Lee
■260    ▼a서울▼b대한금속.재료학회▼c2001.
■300    ▼app.  493-498
■653    ▼aPACKAGE▼aWAFER▼aLEVEL▼aELECTROMIGRATION▼aTEST▼aALCU▼aINTERCONNECT▼aUNDERLAYERS
■700    ▼aYoung  Bae  Par,  Dok  Won  Lee
■773    ▼tMetals  and  Materials▼gVOL.7  NO.5  (2001  OCTOBER)▼d2001,  10
■SIS    ▼aS009188▼b60013551▼h8▼s2

Preview

Export

ChatGPT Discussion

AI Recommended Related Books


    New Books MORE
    Related books MORE
    Statistics for the past 3 years. Go to brief
    Recommend

    detalle info

    • Reserva
    • No existe
    • Mi carpeta
    • Reference Materials for Thesis Writing
    • Reference Materials for Research Ethics
    • Job-Related Books
    Material
    número de libro número de llamada Ubicación estado Prestar info
    AR05791 P   참고자료실(관광학관2층) 대출불가 대출불가
    My Folder 부재도서신고

    * Las reservas están disponibles en el libro de préstamos. Para hacer reservaciones, haga clic en el botón de reserva

    Books borrowed together with this book

    Related books

    Related Popular Books

    도서위치