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Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Detailed Information
- Material Type
- 기사
- ISSN
- 12259438
- Title/Author
- Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects / 공저 Young Bae Park,Duk Won Lee
- Publish Info
- 서울 : 대한금속.재료학회, 2001.
- Material Info
- pp. 303-310
- Index Term-Uncontrolled
- EFFECTS TEXTURE ANS GRAIN STRUCTURE ELECTROMIGRATION LIFETIME ALCU INTERCONNECTS
- Added Entry-Personal Name
- Young Bae Park,Duk Won Lee
- Host Item Entry
- Metals and Materials : VOL.7 NO.4 (2001 AUGUST) 2001, 08
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60017409
MARC
008000107s2001 ULKa a ENG■022 ▼a12259438
■245 ▼aEffects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects▼d공저 Young Bae Park,Duk Won Lee
■260 ▼a서울▼b대한금속.재료학회▼c2001.
■300 ▼app. 303-310
■653 ▼aEFFECTS▼aTEXTURE▼aANS▼aGRAIN▼aSTRUCTURE▼aELECTROMIGRATION▼aLIFETIME▼aALCU▼aINTERCONNECTS
■700 ▼aYoung Bae Park,Duk Won Lee
■773 ▼tMetals and Materials▼gVOL.7 NO.4 (2001 AUGUST)▼d2001, 08
■SIS ▼aS009187▼b60013551▼h8▼s2
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