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Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
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MARC
008000107s2001 ULKa a ENG■022 ▼a12259438
■245 ▼aEffects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects▼d공저 Young Bae Park,Duk Won Lee
■260 ▼a서울▼b대한금속.재료학회▼c2001.
■300 ▼app. 303-310
■653 ▼aEFFECTS▼aTEXTURE▼aANS▼aGRAIN▼aSTRUCTURE▼aELECTROMIGRATION▼aLIFETIME▼aALCU▼aINTERCONNECTS
■700 ▼aYoung Bae Park,Duk Won Lee
■773 ▼tMetals and Materials▼gVOL.7 NO.4 (2001 AUGUST)▼d2001, 08
■SIS ▼aS009187▼b60013551▼h8▼s2
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