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Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Detailed Information
- 자료유형
- 기사
- ISSN
- 12259438
- 서명/저자
- Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System / 공저 Young Bae Park,Jin Yu
- 발행사항
- 서울 : 대한금속.재료학회, 2001.
- 형태사항
- pp. 123-132
- 키워드
- EFFECTS ELECTROPLATED CU THICKNESS PLYMIDE PLASMA TREATMENT CONDITIONS INTERFACIAL FRACTURE MECHANICS PARAMETERS CUCRPLYIMIDE SYSTEM
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60017335
MARC
008000106s2001 ULKa a ENG■022 ▼a12259438
■245 ▼aEffects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System▼d공저 Young Bae Park,Jin Yu
■260 ▼a서울▼b대한금속.재료학회▼c2001.
■300 ▼app. 123-132
■653 ▼aEFFECTS▼aELECTROPLATED▼aCU▼aTHICKNESS▼aPLYMIDE▼aPLASMA▼aTREATMENT▼aCONDITIONS▼aINTERFACIAL▼aFRACTURE▼aMECHANICS▼aPARAMETERS▼aCUCRPLYIMIDE▼aSYSTEM
■700 ▼aYoung Bae Park,Jin Yu
■773 ▼tMetals and Materials▼gVOL.7 NO.2 (2001 APRIL)▼d2001, 04
■SIS ▼aS009185▼b60013551▼h8▼s2
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