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Deposition Characteristics of Low Dielectric Constant SiOF Films Prepared by ECR PECVD
Deposition Characteristics of Low Dielectric Constant SiOF Films Prepared by ECR PECVD
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MARC
008000104s2000 ULKa a ENG■022 ▼a12259438
■245 ▼aDeposition Characteristics of Low Dielectric Constant SiOF Films Prepared by ECR PECVD▼d공저 Kyung-Mun Byun,Won-Jong Lee
■260 ▼a서울▼b대한금속.재료학회▼c2000.
■300 ▼app. 155-160
■653 ▼aDEPOSITION▼aCHARACTERISTICS▼aDIELECTRIC▼aCONSTANT▼aSIOF▼aFILMS▼aPREPARED▼aECR▼aPECVD
■700 ▼aKyung-Mun Byun,Won-Jong Lee
■773 ▼tMetals and Materials▼gVOL.6 NO.2 (2000 APRIL)▼d2000, 04
■SIS ▼aS009179▼b60013551▼h8▼s2


