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Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies
Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies
상세정보
- 자료유형
- 단행본
- ISBN
- 0071351418
- 청구기호
- 567.65 L36l
- 저자명
- Lau, John H.
- 서명/저자
- Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / John H. Lau.
- 발행사항
- New York : McGraw-Hill, c2000.
- 형태사항
- xxii, 585 p : ill. ; 24 cm.
- 서지주기
- Includes bibliographical references and index
- 가격
- 55000
- Control Number
- kjul:60006056
MARC
008030310s2000 nyua b 001 0 eng■020 ▼a0071351418
■035 ▼aKRIC07643375
■090 ▼a567.65▼bL36l
■1001 ▼aLau, John H.
■24510▼aLow cost flip chip technologies ▼bfor DCA, WLCSP, and PBGA assemblies▼dJohn H. Lau.
■260 ▼aNew York▼bMcGraw-Hill▼cc2000.
■300 ▼axxii, 585 p▼bill.▼c24 cm.
■504 ▼aIncludes bibliographical references and index
■9500 ▼b55000
